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 GT30J324
TOSHIBA Insulated Gate Bipolar Transistor Silicon N Channel IGBT
GT30J324
High Power Switching Applications Fast Switching Applications
* * * The 4th generation Enhancement-mode Fast switching (FS): Operating frequency up to 50 kHz (reference) High speed: tf = 0.05 s (typ.) Low switching loss : Eon = 1.00 mJ (typ.) : Eoff = 0.80 mJ (typ.) * * Low saturation voltage: VCE (sat) = 2.0 V (typ.) FRD included between emitter and collector Unit: mm
Maximum Ratings (Ta = 25C)
Characteristics Collector-emitter voltage Gate-emitter voltage Collector current Emitter-collector forward current Collector power dissipation (Tc = 25C) Junction temperature Storage temperature range DC 1 ms DC 1 ms Symbol VCES VGES IC ICP IF IFM PC Tj Tstg Rating 600 20 30 60 30 60 170 150 -55 to 150 Unit V V A
JEDEC JEITA TOSHIBA
2-16C1C
A W C C
Weight: 4.6 g (typ.)
Thermal Characteristics
Characteristics Thermal resistance (IGBT) Thermal resistance (diode) Symbol Rth (j-c) Rth (j-c) Max 0.735 1.90 Unit C/W C/W
Equivalent Circuit
Collector
Gate Emitter
1
2002-04-19
GT30J324
Electrical Characteristics (Ta = 25C)
Characteristics Gate leakage current Collector cut-off current Gate-emitter cut-off voltage Collector-emitter saturation voltage Input capacitance Turn-on delay time Rise time Switching time Turn-on time Turn-off delay time Fall time Turn-off time Turn-on switching loss Turn-off switching loss Symbol IGES ICES VGE (OFF) VCE (sat) Cies td (on) tr ton td (off) tf toff Eon Eoff VF trr IF = 30 A, VGE = 0 IF = 30 A, di/dt = -100 A/s Inductive Load VCC = 300 V, IC = 30 A VGG = +15 V, RG = 24 (Note 1) (Note 2) Test Condition VGE = 20 V, VCE = 0 VCE = 600 V, VGE = 0 IC = 3 mA, VCE = 5 V IC = 30 A, VGE = 15 V VCE = 10 V, VGE = 0, f = 1 MHz Min 3.5 Typ. 2.0 4650 0.09 0.07 0.24 0.30 0.05 0.43 1.00 0.80 60 Max 500 1.0 6.5 2.45 mJ 3.8 V ns s Unit nA mA V V pF
Switching loss
Peak forward voltage Reverse recovery time
Note 1: Switching time measurement circuit and input/output waveforms
VGE 0 -VGE IC RG VCE 0 VCE 10% td (off) tf toff 10% 10% td (on) tr ton 10% L VCC IC 90% 90%
90% 10%
Note 2: Switching loss measurement waveforms
VGE 0
90% 10%
IC VCE Eoff Eon 5%
0
2
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GT30J324
IC - VCE
60 Common emitter 50 Tc = 25C 20 15 20 10
VCE - VGE
Common emitter
(V)
Tc = -40C 16
(A)
IC
40
Collector-emitter voltage
9
VCE
12
Collector current
30
8 60 30 4 IC = 10 A 0 0 4 8 12 16 20
20 VGE = 8 V 10
0
0
1
2
3
4
5
Collector-emitter voltage
VCE
(V)
Gate-emitter voltage VGE
(V)
VCE - VGE
20 Common emitter 20
VCE - VGE
Common emitter
(V)
Tc = 25C 16
(V)
Tc = 125C 16
VCE
Collector-emitter voltage
12
Collector-emitter voltage
VCE
12 8 30 60 4 IC = 10 A 0 0 4 8 12 16 20 8 30 4 IC = 10 A 0 0 4 8 12 16 20 60
Gate-emitter voltage VGE
(V)
Gate-emitter voltage VGE
(V)
IC - VGE
60 Common emitter 50 VCE = 5 V 4 Common emitter
VCE (sat) - Tc
Collector-emitter saturation voltage VCE (sat) (V)
VGE = 15 V 3 60
(A) Collector current IC
40
30
2
30
20
IC = 10 A 1
10 Tc = 125C 0 0 4 8
25 -40 12 16 20
0 -60
-20
20
60
100
140
Gate-emitter voltage VGE
(V)
Case temperature Tc
(C)
3
2002-04-19
GT30J324
Switching time ton, tr, td (on) - RG
10 Common emitter VCC = 300 V VGG = 15 V IC = 30 A : Tc = 25C : Tc = 125C (Note 1) 3
Switching time ton, tr, td (on) - IC
Common emitter VCC = 300 V VGG = 15 V RG = 24 : Tc = 25C : Tc = 125C (Note 1)
(s)
3
(s)
ton, tr, td (on)
1
1
ton, tr, td (on)
0.3 ton 0.1 td (on)
0.3 ton 0.1 td (on) tr
Switching time
Switching time
0.03
0.03 tr 0.01 0
0.01 1
3
10
30
100
300
1000
5
10
15
20
25
30
Gate resistance RG
()
Collector current
IC
(A)
Switching time toff, tf, td (off) - RG
10 Common emitter VCC = 300 V VGG = 15 V IC = 30 A : Tc = 25C : Tc = 125C (Note 1) 10
Switching time toff, tf, td (off) - IC
Common emitter VCC = 300 V VGG = 15 V RG = 24 : Tc = 25C : Tc = 125C (Note 1) toff 0.3 td (off) tf 0.1
(s)
(s)
3
3
toff, tf, td (off)
1
toff, tf, td (off) Switching time
30 100 300 1000
1
0.3
Switching time
toff td (off)
0.1
0.03
tf
0.03
0.01 1
3
10
0.01 0
5
10
15
20
25
30
Gate resistance RG
()
Collector current
IC
(A)
Switching loss
30 Common emitter VCC = 300 V VGG = 15 V IC = 30 A : Tc = 25C : Tc = 125C (Note 2)
Eon, Eoff - RG
3
Switching loss
Eon, Eoff - IC
(mJ)
(mJ)
10
1
Eon
Eon, Eoff
3
Eon
Eon, Eoff
0.3 Eoff 0.1 Common emitter VCC = 300 V VGG = 15 V RG = 24 : Tc = 25C : Tc = 125C (Note 2) 5 10 15 20 25 30
Switching loss
1 Eoff 0.3
Switching loss
10 30 100 300 1000
0.03
0.1 1
3
0.01 0
Gate resistance RG
()
Collector current
IC
(A)
4
2002-04-19
GT30J324
C - VCE
10000 500 Common emitter RL = 10 Tc = 25C
VCE, VGE - QG
20
(pF)
VCE
400
16
1000
Collector-emitter voltage
300 300 200
200
12
300
8 VCE = 100 V
100 Common emitter VGE = 0 30 f = 1 MHz Tc = 25C 10 0.1 0.3 1 3 10 30 100 300 1000 Coes Cres
100
4
0 0
40
80
120
160
0 200
Collector-emitter voltage
VCE
(V)
Gate charge
QG
(nC)
IF - VF
60 Common collector Irr 3 10
trr, Irr - IF
1000
(A)
Reverse recovery current Irr
Forward current IF
40
30
1 trr Common collector di/dt = -100 A/s VGE = 0 : Tc = 25C : Tc = 125C 5 10 15 20 25
100
20 25 10 Tc = 125C -40 0 0 0.6 1.2 1.8 2.4 3.0 3.6
0.3
30
0.1 0
10 30
Forward voltage
VF
(V)
Forward current
IF
(A)
Safe Operating Area
100 IC max (pulsed)* IC max (continuous) 100 s* 10 DC operation 3 *: Single pulse Tc = 25C 1 ms* 50 s* 30 100
Reverse Bias SOA
30
(A)
(A)
IC
Collector current
Collector current
IC
10
3
1
1
Curves must be derated linearly 0.3 with increase in temperature. 0.1 1 3 10 30 100
0.3 10 ms* 300 1000 0.1 1
Tj 125C VGE = 15 V RG = 24 3 10 30 100 300 1000
Collector-emitter voltage
VCE
(V)
Collector-emitter voltage
VCE
(V)
5
2002-04-19
Reverse recovery time
trr
300
(ns)
50 VGE = 0
(A)
Gate-emitter voltage VGE
Capacitance C
(V)
3000
Cies
(V)
GT30J324
rth (t) - tw
(C/W)
102
101 FRD 100 IGBT 10-1
Transient thermal resistance
rth (t)
10-2
10-3 Tc = 25C 10
-4
10-4 10-5
10
-3
10
-2
10
-1
10
0
101
102
Pulse width
tw
(s)
6
2002-04-19
GT30J324
RESTRICTIONS ON PRODUCT USE
000707EAA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
7
2002-04-19


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